Wafer cutting aids and large-scale high-rigidity wire EDM for semiconductor production

In the field of semiconductor production, wafer cutting auxiliary tools are one of the key components to ensure the accuracy and efficiency of chip manufacturing. With the continuous advancement of semiconductor technology, wafer size is getting larger and larger, and the cutting accuracy requirements are getting higher and higher, which poses unprecedented challenges to processing equipment. Large-scale high-rigidity wire EDM machines have become an ideal choice for processing these difficult parts due to their high precision, high stability and high rigidity. This article will explore in depth which parts in semiconductor production need to be processed by large-scale high-rigidity wire EDM machines, analyze the difficulties in processing, and demonstrate Zhikai CNC's technical advantages and service guarantees in the industry through product analysis of case customers.

1. Key components in semiconductor production and large-scale high-rigidity wire-cut EDM machines

Semiconductor production involves a variety of high-precision parts, among which the manufacture of wafer cutting auxiliary tools is particularly critical. These tools are usually made of high-hardness, high-wear-resistant materials, with complex geometries and extremely high precision requirements. Large-scale high-rigidity wire EDM machines have become the preferred equipment for processing these parts due to their high precision, high stability and high rigidity. The following are several common types of parts in semiconductor production that require large-scale high-rigidity wire EDM machines to process:

1. Wafer cutting auxiliary tools: such as cutting blades, fixtures, etc. These tools require extremely high dimensional accuracy and surface finish to ensure the accuracy and efficiency of wafer cutting.

2. Precision components of semiconductor equipment: such as vacuum chambers, sensor brackets, etc. These components need to maintain stable performance in extreme environments, which places extremely high demands on processing accuracy and material properties.

3. Semiconductor molds: such as lead frame molds, packaging molds, etc. These molds require high-precision processing to ensure the packaging quality of semiconductor devices.

2. Analysis of processing difficulties

1. Processing of high-hardness materials: Wafer cutting auxiliary tools usually use high-hardness materials, such as cemented carbide, ceramics, etc. These materials have high hardness and good wear resistance, but are difficult to process, and traditional processing methods are difficult to ensure accuracy and surface quality.

2. Processing of complex geometric shapes: Wafer cutting auxiliary tools usually have complex geometric shapes, such as curved surfaces, special-shaped holes, etc., which puts higher requirements on the accuracy and flexibility of processing equipment.

3. High precision and surface quality requirements: Semiconductor production has extremely high requirements for the precision of wafer cutting auxiliary tools. The dimensional tolerance is usually controlled within ≤±0.003mm, and the surface finish must reach Ra≤0.7-1.4μm, which places extremely high demands on processing equipment.

3. Product Analysis of Case Customers

A semiconductor manufacturing company adopted Zhikai CNC's large-scale, high-rigidity wire-cut EDM machine in the production of wafer cutting auxiliary tools, and achieved remarkable results.

1. Improved processing efficiency: After adopting large-scale high-rigidity wire EDM machine tools, the processing efficiency of wafer cutting auxiliary tools has increased by more than 30%, greatly shortening the production cycle and meeting customers' needs for fast delivery.

2. Improved processing accuracy: The dimensional tolerance of wafer cutting auxiliary tools is controlled within ≤±0.003mm, and the surface finish reaches Ra≤0.7-1.4μm, which fully meets the requirements of semiconductor production for high-precision parts.

3. Improved material utilization: The material loss is small during the EDM wire cutting process, and the material utilization rate is increased by more than 20%, which reduces production costs and improves economic benefits.

4. Zhikai CNC's technical advantages and service guarantees

As a leading CNC equipment manufacturer in the industry, Zhikai CNC has always been committed to the research and development and application of high-precision and high-efficiency processing technologies. Our large-scale high-rigidity wire EDM machines have performed well in the processing of semiconductor production parts and have been well received by customers.

1. Focus on R&D and Leading Technology: Zhikai CNC has a strong R&D team that continuously introduces new technologies and processes to ensure that our equipment is always in the leading position in the industry. Large-scale high-rigidity wire EDM machines use advanced CNC systems and intelligent algorithms to achieve high-precision processing of complex shapes.

2. Perfect after-sales service, trustworthy: We provide a full range of after-sales services, including equipment installation and commissioning, operation training, regular maintenance, etc., to ensure the long-term stable operation of customer equipment. Zhikai CNC's service team is on call 24 hours a day to solve technical problems for customers at any time.

3. Diversified processing recommendations: In addition to wafer cutting auxiliary tools, Zhikai CNC's large-scale high-rigidity EDM wire cutting machine tools are also widely used in the processing of other high-precision parts, such as aerospace components, medical equipment parts, etc., to meet the diverse needs of different customers.

V. Conclusion

In the field of semiconductor production, wafer cutting auxiliary tools are key components to ensure chip manufacturing accuracy and efficiency. Large-scale high-rigidity wire EDM machines are ideal for processing these difficult parts due to their high precision, high stability and high rigidity. As an industry-leading CNC equipment manufacturer, Zhikai CNC has always been committed to the research and development and application of high-precision and high-efficiency processing technologies. Our large-scale high-rigidity wire EDM machines have performed well in the processing of semiconductor production parts and have been well received by customers.

Zhikai's medium-speed wire-cut machine tools are known for their ultra-high precision and excellent stability. Relying on core technologies such as the independently developed slow-speed wire-cut system and primary color processing high-frequency power supply, it provides customers with low-energy consumption and high-efficiency processing solutions. Comprehensive after-sales support and customized services ensure that every user can experience safe and reliable equipment performance. Zhikai interprets quality with strength. Its various machine tools, such as DK7735caxa wire cutting machine, large high-workpiece medium-speed wire cutting machine, 7740 five-axis metal wire cutting machine, small high-voltage electric spark wire cutting, micro aluminum cutting machine wire cutting, C-type wire cutting machine, 630 precision spark wire cutting, ZKA400 wire cutting machine spark wire cutting, 5003 meter wire cutting machine, have injected strong impetus into the transformation and upgrading of industries such as refrigeration equipment: fine processing of air-conditioning evaporator fins, new energy charging piles: charging gun cable fixing devices, medical equipment: fine processing of medical endoscope lens seats, papermaking machinery: blade clamps of paper cutting machines, etc.